We are capable of using the following processes on 100 mm (4 inch) wafers:
Thermal Diffusion and Oxidation
- Furnace
Etching
- Wet Benches
- Wet Etching
- Deep Si Etching for diaphragms
- Reactive Ion Etching
Film Deposition and Growth
- Sputtering Systems (DC & RF/DC)
- Furnace (Oxidation)
Lithography
- Spin Coaters
- Mask Aligner
- Spin Rinse Dryer
Metrology
- Reflectometer
- Ellipsometer
- Profilometer
- Optical Microscope
- Four-Point Resistivity Probe
- Angle Lapping (Dopant Depth)
- AFM
- SEM
- XRD
- XRF
Soft Lithography
- Plasma Treatment
- Vacuum Evaporator
